BYK-1790 is a silicone-free, polymer-based defoamer designed for solvent-free, radiation-curing coatings, printing inks, and adhesives. It is suitable for both pigmented and unpigmented systems, including wood coatings, radiation-curable inks, and hot melt adhesives. This defoamer is effective in radiation cure applications and is compatible with wood substrates.

Functions: Defoamer

Chemical Family: Polyolefins

End Uses: Hot Melt Adhesive, Printing Ink, Radiation Curable Adhesive, Radiation Curable Coating, Radiation Curable Ink, Wood Coating

Labeling Claims: Silicone-free, Solvent-free

Enhanced TDS

Identification & Functionality

Chemical Family
Manufactured By
CASE Ingredients Functions
Technologies
Product Families

Features & Benefits

Applications & Uses

Markets
Applications
Application Area
Compatible Substrates & Surfaces
Cure Method
Adhesive & Sealant End Applications
Coating End Applications
Ink & Toner End Applications
Use Level
0.1 - 0.7% (Coatings and Printing inks), 0.1 - 0.7% (Adhesives & Sealants)
Product Application

Coatings and Printing Inks
Special Features and Benefits

BYK-1790 is silicon-free and is recommended for solvent-free, radiation-curing (UV and ESH) coating systems (pigmented and unpigmented), printing inks and overprint varnishes. The high efficiency of the defoamer is not impacted by pigments, fillers, wax additives or matting agents.
Recommended Levels
0.1-0.7% additive (as supplied) based upon the total formulation. The above recommended levels can be used for orientation. Optimal levels are determined through a series of laboratory tests.
Incorporation and Processing Instructions
Due to its high incompatibility, the defoamer must be incorporated at high shear forces (in the mill base) to ensure good distribution. Otherwise defects may occur in the system.

Adhesives & Sealants
Special Features and Benefits

BYK-1790 is silicon-free and is recommended for solvent-free, radiation-curing (UV and ESH) adhesives (pigmented and unpigmented) as well as for reactive polyurethane hot melt adhesives. It has no negative effect on the adhesive properties of the adhesives. In radiation-curing formulations, BYK-1790 is ideal for universal use in acrylate based binders. It prevents foaming in the manufacture of reactive polyurethane hot melt adhesives even at high viscosity. Significantly shorter evacuation times lead to an increase in the
efficiency of production due to the additive.
Recommended Levels
0.1-0.7% additive as supplied based on the total formulation The above recommended levels can be used for orientation. Optimal levels are determined
through a series of laboratory tests.
Incorporation and Processing Instructions
Due to its high incompatibility, the defoamer must be incorporated at high shear forces (in the mill base) to ensure good distribution. Otherwise defects may occur in the system.

Properties

Physical Form
Typical Properties
ValueUnitsTest Method / Conditions
Non-Volatile Matter (10 min, at 150°C)100%-
Density (at 20°C)0.85g/ml-
SDS Physical and Chemical Properties
ValueUnitsTest Method / Conditions
Auto Ignition Tempertauremin. 200°CDIN 51794
Boiling Pointmin. 100°CDerived
Flash Pointmin. 260°CASTM D 93
Pour Pointmax. -30°C-
Kinematic Viscosity (at 40°C)399cSt-
Density (at 20°C, 1013 hPa)0.846g/cm³Oscillating U-tube
Vapour Pressure (at 20°C)max. 0.13hPaDerived
AppearanceLiquid--
ColorColorless
Flammability (liquids)Sustains Combustion--
Immiscible InWater--
OdorOdorless--
pH (at 20°C, Concentration: 1%)7-Universal pH-Value Indicator
Composition Data

Mixture of foam-destroying polymers, silicone-free

Regulatory & Compliance

OEM Specifications