Enhanced TDS
Identification & Functionality
- Manufactured By
- Composite Materials Functions
- Technologies
- Product Families
Applications & Uses
- Application Area
- Compatible Polymers & Resins
- Use Level
- 0.5 - 1% (Additive Ambient Curing Resin Systems), 0.2 - 0.5% (Non - Thixotropic)
- Application Information
Ambient curing resin systems
Special Features and Benefits
BYK-S 740 is a highly effective additive for reducing monostyrene emission in orthophthalic resins for open mold processing techniques. Using the product does not adversely affect interlaminar adhesion.
Recommended Use
BYK-S 740 is particularly recommended for orthophthalic resins and can also be used in isophthalic resins.
Recommended Levels
0.5-1% additive (as supplied) based on the total formulation.
The above recommended levels can be used for orientation. Optimal levels are determined through a series of laboratory tests.Incorporation and Processing Instructions
BYK-S 740 should be added to the resin whilst stirring before adding other formulation components. If you require even easier handling, we recommend melting the product (max. 40 °C) and stirring the liquid BYK-S 740 into the resin. If melting is not possible, incorporating 5-20 % monostyrene creates a soft paste, which readily dissolves in the resin. The mixture of BYK-S 740 and monostyrene should not be stored any longer than 24 hours and should be mixed well before processing.
Special Note
In non-thixotropic resins, BYK-S 740 tends to flocculate and floats to the resin surface during storage. In the case of separation, the resin must be stirred before processing. To achieve good storage stability of BYK-S 740 in non-thixotropic resins, 0.2-0.5 % BYK-LP W 6236 can be used in combination with BYK-S 740.
Properties
- Physical Form
- Typical Properties
Value Units Test Method / Conditions Density (at 40°C) 0.86 g/ml - Refractive Index (at 40°C) 1.456 - - Flash Point 66.0 °C - Acid Value max. 7 mg KOH/g - - SDS Physical and Chemical Properties
Value Units Test Method / Conditions Lower Explosion Limit 0.6 %V Upper Explosion Limit 6 %V Auto Ignition Tempertaure min. 200 °C Derived, DIN 51794 Flash Point 66 °C DIN 51755, Abel-Pensky Initial Boiling Point 176 °C Derived Melting Point (May crystallize, even at room temperature.) max. 0 °C Derived Density (at 40°C) 0.86 g/cm³ Oscillating U-tube Vapour Pressure (at 20°C) 3 hPa Derived Kinematic Viscosity (at 40°C) 40 mm²/s - Appearance Paste - - Color Light yellow - - Flammability (liquids) Sustains Combustion - - Immiscible In Water - - pH (at 20°C, Concentration: 1%) 6 - Universal pH-Value Indicator - Composition Data
Solution of hydroxypolyesters with paraffin wax.
Regulatory & Compliance
- OEM Specifications
Storage & Handling
- Storage Conditions
Separation or turbidity may occur during storage and transportation. Mix well before use.