BYK-A 535 T is a silicone-free air release additive for solvent-borne and solvent-free epoxy and polyurethane systems.

Chemical Family: Cellulose & Cellulosics, Cellulose Ethers, Epoxy & Epoxy Derivatives, Polyurethanes (PU)

Labeling Claims: Silicone-free

Compatible Polymers & Resins: Epoxies (EP), Polyurethanes (PU)

End Uses: Epoxy Adhesive, Epoxy Coating, Epoxy Sealant, Polyurethane Adhesives, Polyurethane Coating, Polyurethane Sealant, Protective Coatings, Solvent Free (100% Solids) Adhesive, Solvent Free (100% Solids) Sealant, Solventborne Adhesive, Solventborne Sealant

Enhanced TDS

Identification & Functionality

Features & Benefits

Labeling Claims
Materials Features

Applications & Uses

Markets
Applications
Application Area
Compatible Polymers & Resins
Adhesive & Sealant End Applications
Coating End Applications
Use Level
0.1 - 1% (Coatings Industry), 0.1 - 1% (Thermosets), 0.1 - 1% (Adhesives and Sealants)
Application Information

Thermosets
Special features and benefits

Air release additive to prevent foam and bubbles during the manufacture and application of thermoset systems. It is particularly suitable for use in roof waterproofing and casting resins based on polyurethanes or epoxy resin systems.
Recommended levels
0.1–1% additive (as supplied) based upon total formulation.
The above recommended levels can be used for orientation. The optimum dosage should be determined by application-related test series.
Incorporation and processing instructions
Stir into the resin before adding other components. It is also possible to add the additive to finished systems.

 

Adhesives and sealants
Special features and benefits

BYK-A 535 T is a defoamer for all solvent-borne and solvent-free adhesives and sealants. Particularly recommended for systems that are based on polyurethane and epoxy resins. BYK-A 535 T may cause cloudiness in transparent systems.
Recommended levels
0.1–1% additive (as supplied) based upon total formulation.
The above recommended levels can be used for orientation. The optimum dosage should be determined by application-related test series.
Incorporation and processing instructions
Stir into the resin before adding other components.

 

Coatings industry
Special features and benefits

BYK-A 535 T is particularly suitable for solvent-free systems such as polyurethane and epoxy coatings. It prevents air bubbles and pinholes. BYK-A 535 T may cause cloudiness in transparent systems.

Recommended levels
0.1–1% additive (as supplied) based upon total formulation.
The above recommended levels can be used for orientation. The optimum dosage should be determined by application-related test series.
Incorporation and processing instructions
To achieve optimal defoaming, the defoamer should be added already to the mill base. If incorporating at a later stage, sufficiently high shear forces must be applied to ensure a good distribution and to prevent cratering.

Properties

Physical Form
Typical Properties
ValueUnitsTest Method / Conditions
Density (at 20°C)0.86g/ml-
Refractive Index (at 20°C)1.475--
SDS Physical and Chemical Properties
ValueUnitsTest Method / Conditions
Auto Ignition Tempertauremin. 200°CDIN 51794
Boiling Pointmin. 150°CDerived
Flash Point (at 1013 hPa)min. 150°C-
Melting Pointmax. 0°CDerived
Density (at 20°C, 1013 hPa)0.863g/cm³Oscillating U-tube
Vapour Pressure (at 20°C)max. 0.1hPaDerived
Dynamic Viscosity (at 20°C)344mPa.sP/K 20°C
AppearanceLiquid--
ColorColorless, clear
Flammability (liquids)Sustains Combustion--
Immiscible InWater--
pH (at 20°C, Concentration: 1%)6-Universal pH-Value Indicator
Composition Data

Solution of foam-destroying polymers, silicone-free

Regulatory & Compliance

OEM Specifications