48 Products found on Omya Group
NAN YA NPES-903 is a solid epoxy resin of medium molecular weight, synthesized from epichlorohydrin and bisphenol A. Specifically designed for powder coating applications, it, when cured with polyester or dicyandiamide, offers excellent properties such as high gloss, flexibility, and smoothness.
The materials provided at this site are provided "as is" without any warranties of any kind including warranties of merchantability, fitness for a particular purpose or of any other nature regarding the information presented in this site, or non-infringement of intellectual property.
BYK-306 is a silicone-containing surface additive for ambient-curing plastic systems and solvent-borne coating systems. It provides a strong reduction of surface tension, excellent substrate wetting, prevents cratering, and increases surface slip.
Spolchemie CHS-Epoxy 520 is a low molecular weight bisphenol A-type epoxy resin, suitable for curing at ambient or elevated temperatures. It is ideal for use in electrical encapsulation, casting applications, tooling, and potting processes. This resin is unmodified and is classified under the epoxy and epoxy derivatives chemical family. It is a liquid form material.
Araldite® GY - 783 is used in industrial additives and materials.
Huntsman Modifier DW 1765 is a paste industrial additive.
Spolek CHS-Epoxy 171 is a low molecular weight solid epoxy resin, classified as "type 1.5." It is a yellow, solid material used as a binder and resin in powder coatings and solventborne coatings. This resin is based on poly(bisphenol A-co-epichlorohydrin) glycidyl end-capped and belongs to the epoxy and epoxy derivatives chemical family. It complies with multiple EU regulations, including Regulation (EU) No. 1272/2008 and EC No. 1907/2006.
Araldite® GY - 793 is used in industrial additives and materials.
Araldite® EPN - 1180x80 is a resin used in industrial additives and materials.
NAN YA NPEF-170 is a BPF-type epoxy resin that offers low viscosity and high flow characteristics, making it ideal for non-solvent (100% solid) applications in coatings, molding, and more. It enhances flexibility and adhesive strength, making NPEF-170 an excellent choice for civil engineering and electrical insulation materials.
Spolchemie CHS-Epoxy 498 is a low molecular weight epoxy resin modified with a mono-functional reactive diluent. It offers low viscosity and is suitable for curing at ambient or elevated temperatures. This resin is ideal for use in potting, electrical encapsulation, and other composite materials applications. It is a lower-viscosity version of CHS-Epoxy 521. Spolchemie CHS-Epoxy 498 functions as a binder and resin in various industrial processes.
Araldite® GY - 289 is used in industrial additives and materials.
BYK-A 530 is a silicone- and polymer-containing defoamer and air release additive for solvent-borne and solvent-free coatings, ambient-curing plastic systems, pultrusion applications, adhesives, and sealants. It is particularly recommended for epoxy resin systems.
Araldite® PZ - 985 E is used in industrial additives and materials.
Spolek CHS-Epoxy 160 is a higher molecular weight epoxy resin with an average molecular weight of approximately 1250 g/mol. It is a solid, yellow material soluble in n-butyl acetate, ketones, and glycol ethers. This resin is used as a binder and resin in powder coating applications and is compatible with amino resins and phenolics. It is classified under the epoxy and epoxy derivatives chemical family and complies with multiple EU regulations, including Regulation (EU) No. 67/548/EEC and Regulation (EU) No. 1272/2008.
NAN YA NPSN-901X75 is a 75% non-volatile solution of poly(bisphenol a-co-epichlorohydrin) glycidyl end-capped in xylene, designed for use in anticorrosive paints. When cured with polyamide or polyamine hardeners, it provides good chemical resistance and strong physical properties. This liquid epoxy resin functions as a binder and resin, offering durability and performance in coatings.
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