Products

BYK-361 N is a polyacrylate-based surface additive for solvent-borne and solvent-free coatings, UV-reactive printing inks, overprint varnishes, and powder coatings. It improves leveling, prevents craters, and is suitable for ambient curing plastic systems. This is the solvent-free version of BYK-358 N.

Spolchemie CHS-Epoxy 498 is a low molecular weight epoxy resin modified with a mono-functional reactive diluent. It offers low viscosity and is suitable for curing at ambient or elevated temperatures. This resin is ideal for use in potting, electrical encapsulation, and other composite materials applications. It is a lower-viscosity version of CHS-Epoxy 521. Spolchemie CHS-Epoxy 498 functions as a binder and resin in various industrial processes.

BYK-A 530 is a silicone- and polymer-containing defoamer and air release additive for solvent-borne and solvent-free coatings, ambient-curing plastic systems, pultrusion applications, adhesives, and sealants. It is particularly recommended for epoxy resin systems.

BYK-306 is a silicone-containing surface additive for ambient-curing plastic systems and solvent-borne coating systems. It provides a strong reduction of surface tension, excellent substrate wetting, prevents cratering, and increases surface slip.

BYK-A 535 T is a silicone-free air release additive for solvent-borne and solvent-free epoxy and polyurethane systems.

Spolek CHS-EPOXY G 520 is a single-ingredient binder and resin used in CASE (Coatings, Adhesives, Sealants, and Elastomers) applications. It also functions as a binder and matrix material in composite materials, providing essential structural properties in various formulations.

NAN YA NPSN-901X75 is a 75% non-volatile solution of poly(bisphenol a-co-epichlorohydrin) glycidyl end-capped in xylene, designed for use in anticorrosive paints. When cured with polyamide or polyamine hardeners, it provides good chemical resistance and strong physical properties. This liquid epoxy resin functions as a binder and resin, offering durability and performance in coatings.

Spolchemie CHS-Epoxy 520 is a low molecular weight bisphenol A-type epoxy resin, suitable for curing at ambient or elevated temperatures. It is ideal for use in electrical encapsulation, casting applications, tooling, and potting processes. This resin is unmodified and is classified under the epoxy and epoxy derivatives chemical family. It is a liquid form material.

Spolek CHS-Epoxy 160 is a higher molecular weight epoxy resin with an average molecular weight of approximately 1250 g/mol. It is a solid, yellow material soluble in n-butyl acetate, ketones, and glycol ethers. This resin is used as a binder and resin in powder coating applications and is compatible with amino resins and phenolics. It is classified under the epoxy and epoxy derivatives chemical family and complies with multiple EU regulations, including Regulation (EU) No. 67/548/EEC and Regulation (EU) No. 1272/2008.

Spolek CHS-Epoxy 171 is a low molecular weight solid epoxy resin, classified as "type 1.5." It is a yellow, solid material used as a binder and resin in powder coatings and solventborne coatings. This resin is based on poly(bisphenol A-co-epichlorohydrin) glycidyl end-capped and belongs to the epoxy and epoxy derivatives chemical family. It complies with multiple EU regulations, including Regulation (EU) No. 1272/2008 and EC No. 1907/2006.

NAN YA NPEF-170 is a BPF-type epoxy resin that offers low viscosity and high flow characteristics, making it ideal for non-solvent (100% solid) applications in coatings, molding, and more. It enhances flexibility and adhesive strength, making NPEF-170 an excellent choice for civil engineering and electrical insulation materials.

BYK-327 is a silicone-containing surface additive for solvent-borne, solvent-free, radiation-curable, and aqueous systems. It improves leveling and provides a defoaming effect in floor coatings.

NAN YA NPEL-128 is a liquid resin made from bisphenol-A and epichlorohydrin. It is recognized as a standard form, with variations developed for specific applications. Cured NPEL-128 provides high-quality, high-purity properties, including maximum mechanical strength, good chemical resistance, and excellent heat resistance.

BYK-310 is a silicone-containing surface additive for solvent-free and solvent-borne coating systems, printing inks, adhesive systems, and ambient-curing plastic systems. It provides a strong reduction in surface tension and is thermostable up to 210°C.

NAN YA NPES-903 is a solid epoxy resin of medium molecular weight, synthesized from epichlorohydrin and bisphenol A. Specifically designed for powder coating applications, it, when cured with polyester or dicyandiamide, offers excellent properties such as high gloss, flexibility, and smoothness.