Spolchemie CHS-Epoxy 498

1 of 2 products in this brand
Spolchemie CHS-Epoxy 498 is a low molecular weight epoxy resin modified with a mono-functional reactive diluent. It offers low viscosity and is suitable for curing at ambient or elevated temperatures. This resin is ideal for use in potting, electrical encapsulation, and other composite materials applications. It is a lower-viscosity version of CHS-Epoxy 521. Spolchemie CHS-Epoxy 498 functions as a binder and resin in various industrial processes.

Chemical Family: Epoxy & Epoxy Derivatives, Fatty Acid Esters

Applicable Processes: Electrical Encapsulation, Impregnation, Potting

Enhanced TDS

Identification & Functionality

Features & Benefits

Industrial Additives Features

Applications & Uses

Applicable Processes
Industrial Additives End Use
Product Uses

Designed for potting, adhesive bonding, laminating and impregnation. Further use is in casting compounds, polymer concrete, self levelling floorings and in sealing and patching agents.

Properties

Physical Form
Typical Properties
ValueUnitsTest Method / Conditions
Epoxy Equivalent Weight196 - 208g/molISO 3001
Epoxy Index4.8 - 5.1mol/kgISO 3001
Colormax. 100-ISO 6271-2, Hazen
Viscosity (at 25°C)0.5 - 0.7Pa.sDIN 53015
SDS Physical and Chemical Properties
ValueUnitsTest Method / Conditions
Viscosity500 - 700mPa.s-
Immiscible inWater--
Relative Density (at 20°C)1.1g/cc-
Flash Pointmin. 200°C-
OdorSlight characteristic--
ColorClear liquid--
Mixing Ratio
SYSTEM b.m.
CHS-EPOXY 498-CHS-HARDENER P-11 100 : 11

Short pot life, high chemical resistar

CHS-EPOXY 498-TELALIT 410 100 : 17 Short pot life
CHS-EPOXY 498-TELALIT 60 100 : 30

For curing at low temperature

CHS-EPOXY 498-TELALIT 0420 100 : 21

Medium pot life,high performance

CHS-EPOXY 498-TELALIT 0492 100 : 24 Medium pot life
CHS-EPOXY 498-TELALIT 0563 100 : 28

Medium pot-life, high flexibility

CHS-EPOXY 498-TELALIT 0590 100 : 29

Medium pot-life, high flexibility

CHS-EPOXY 498-TELALIT 0600 100 : 30

Long pot-life high Tg

Regulatory & Compliance

Technical Details & Test Data

Techical Information

After curing, subsequent heat treatment is advised to enhance the mechanical and thermal properties. Optimal post curing conditions for maximum mechanical properties of most epoxy systems are for instance 24 hours at room temperature, then 4-24 hours at 60°C followed by 2-20 hours at 120-140°C.The most important factor is to be aware of thermal shock during cooling to room temperature after post-curing.

Packaging & Availability

Packaging Information

Spolchemie CHS-Epoxy 498 is supplied in 200 l coated steel drums or in other suitable pre-agreed packaging.

Storage & Handling

Storage and Shelf Life Information

Spolchemie CHS-Epoxy 498 should be stored in dry conditions, away from direct sources of heat, preferably in the original containers kept tightly closed. Under these conditions, and at storage temperatures between 5-25°C, the storage life is 12 months.