Products

BYK-3760 is a silicone-containing surface additive for solvent-borne, aqueous, and UV coating systems as well as printing inks. It provides a strong reduction in surface tension, increased surface slip, and minor foam stabilization.

Ceraflour® 993 is a micronized amide wax for powder coatings, designed to improve degassing, acting as a Benzoin-Synergist.

Ceraflour® 913 is a micronized polypropylene wax for solvent-borne and aqueous systems. It creates very fine surface textures, provides a soft feel effect, and offers matting properties.

DURASTAB LT-2 is a single-ingredient stabilizer compatible with polyurethanes (PU) and other resins. It is used to improve the stability of polyurethane-based formulations, providing enhanced performance and durability. It is not a blend, ensuring consistent results in industrial applications.

BYKUMEN is a wetting and dispersing additive for solvent-borne systems that prevents the settling of fillers and inorganic pigments.

Dairen DA-1405 is a vinyl acetate/ethylene copolymer powder that disperses in water to form stable emulsions, recommended for use with inorganic binders like cement and gypsum.

DyStar TR-OX YLW 24A232-GSPAIL is a yellow pigment used in non-aqueous coatings and stains. It provides excellent chemical resistance to dibutylphthalate, ethyl acetate, ethyl alcohol, and glycol. This pigment enhances the color and durability of formulations, offering a vibrant and stable yellow hue for various industrial applications.

MB-166 is a solid acrylic-styrene copolymer designed for concrete curing and sealing applications, providing durability and performance.

Spolchemie CHS-Epoxy 498 is a low molecular weight epoxy resin modified with a mono-functional reactive diluent. It offers low viscosity and is suitable for curing at ambient or elevated temperatures. This resin is ideal for use in potting, electrical encapsulation, and other composite materials applications. It is a lower-viscosity version of CHS-Epoxy 521. Spolchemie CHS-Epoxy 498 functions as a binder and resin in various industrial processes.

Bioban™ BTCM is an aqueous antimicrobial dispersion offering a balance of fast-acting and long-term preservation. It provides formulation flexibility with globally accepted active levels, ensuring effective performance and cost efficiency.

BYK-UV 3535 is a crosslinkable surface additive for radiation-curable systems that enhances leveling and recoatability.

Pchem® BM60-E is a binder and resin compatible with nitrocellulose, acrylonitrile butadiene styrene (ABS), polystyrene (PS), and polyvinyl chloride (PVC). It is used in applications such as acrylic adhesives, plastic coatings, and gravure inks. This resin offers excellent adhesion, fast drying, faster tack-free time, and good pigment dispersion. It also provides heat resistance, high durability, and good compatibility, making it ideal for high-performance applications in coatings and adhesives.

Metasol TK-100 (99.5% TBZ) is an anti-microbial agent, biocide, and fungicide with broad-spectrum efficacy. It is ideal for use in air filters and nylon carpeting. This non-yellowing, thermal-stable ingredient offers excellent toxicological profiles and provides effective dry-film preservation. It is widely used in plastics & elastomers, and industrial additives, ensuring long-lasting protection against microbial growth.

Bionix® ISO2A is a 1.5% solution of 5-chloro-2-methyl-4-isothiazolin-3-one and 2-methyl-4-isothiazolin-3-one. It is a broad-spectrum microbiocide for controlling spoilage, odor-causing, corrosion-inducing, slime-forming bacteria, and fungi in industrial process and water systems, including paper mills, industrial cooling water systems, preservation applications, and oil field processing.

RHEOBYK H 370 is an associative thickener (HEAT) for aqueous systems, designed to produce slightly pseudoplastic flow behavior. It is compatible with wood surfaces and is ideal for wood coatings. This liquid product offers excellent storage stability and is easy to handle. RHEOBYK H 370 is composed of ethers, polyglycols, polyethylene glycols, and amines.