Products

BYK-UV 3530 is a crosslinking, silicone-containing surface additive for aqueous, radiation-curable printing inks and overprint varnishes. It significantly reduces surface tension, provides excellent substrate wetting, and improves leveling in 100% UV systems without affecting surface slip.

BYK-P 105 is a controlled flocculating wetting and dispersing additive for solvent-borne and solvent-free adhesives and ambient-curing resin systems. It stabilizes fillers and is the solvent-free version of BYK-P 104.

BYK-361 N is a polyacrylate-based surface additive for solvent-borne and solvent-free coatings, UV-reactive printing inks, overprint varnishes, and powder coatings. It improves leveling, prevents craters, and is suitable for ambient curing plastic systems. This is the solvent-free version of BYK-358 N.

BYK-337 is a silicone surface additive for solvent-borne and aqueous systems that provides a strong reduction in surface tension.

BYK-081 is a fluorine-free defoamer designed for solvent-borne and amine-neutralized systems. It is particularly effective in solventborne coatings, including can and wood coatings, and is compatible with alkyd resins. This emulsion-based defoamer ensures excellent foam control while maintaining high performance in various coating applications. It is suitable for use on wood substrates and offers the benefit of being fluorine-free, aligning with environmental and safety standards.

RHEOBYK-D 420 is a liquid rheology additive for aqueous systems, designed to generate thixotropic flow behavior.

BYK-W 969 is a wetting and dispersing additive for amine-accelerated UP, EP, and PUR systems and adhesives. It reduces viscosity in mineral-filled systems and integrates into the polymer matrix due to its OH functionality. It also extends gelling time in UP resins with cobalt accelerators.

BYK-1790 is a silicone-free, polymer-based defoamer designed for solvent-free, radiation-curing coatings, printing inks, and adhesives. It is suitable for both pigmented and unpigmented systems, including wood coatings, radiation-curable inks, and hot melt adhesives. This defoamer is effective in radiation cure applications and is compatible with wood substrates.

BYK-3760 is a silicone-containing surface additive for solvent-borne, aqueous, and UV coating systems as well as printing inks. It provides a strong reduction in surface tension, increased surface slip, and minor foam stabilization.

Ceraflour® 993 is a micronized amide wax for powder coatings, designed to improve degassing, acting as a Benzoin-Synergist.

Ceraflour® 913 is a micronized polypropylene wax for solvent-borne and aqueous systems. It creates very fine surface textures, provides a soft feel effect, and offers matting properties.

BYKUMEN is a wetting and dispersing additive for solvent-borne systems that prevents the settling of fillers and inorganic pigments.

BYK-UV 3535 is a crosslinkable surface additive for radiation-curable systems that enhances leveling and recoatability.

RHEOBYK H 370 is an associative thickener (HEAT) for aqueous systems, designed to produce slightly pseudoplastic flow behavior. It is compatible with wood surfaces and is ideal for wood coatings. This liquid product offers excellent storage stability and is easy to handle. RHEOBYK H 370 is composed of ethers, polyglycols, polyethylene glycols, and amines.

BYK-4510 is an adhesion promoter for solvent-borne and aqueous systems, enhancing adhesion on metallic substrates and glass. It provides weather resistance and acts as a coupling agent, improving adhesion properties for coil coatings and other systems applied to metal and glass surfaces. It is in liquid form.